Home > Buy Now > Active Components > Diodes > LED
 
Trade Ok
Member since 2006
left_top_07.jpg


GPT Corporation.
 
icon Power Monitoring System
icon Gear Reducer
icon Panel Component
icon Electrical Equipments
icon Power Relays
icon Electronic Relays
icon Control Switches
icon Power Connector
icon Terminal Block
icon Electric Panel Accessories
icon Testing Equipments
icon AVR
icon Lighting Fixtures
icon Neon Transformers
icon Cable Accessories
icon Electronics
icon Pumps
icon Motor Cylinder/Actuator
icon Compressors
icon Blower

line
icon Greeting
icon TradeVerify TradaVerify
icon Company Profile
icon Selling Leads
icon Major Products
icon Index
icon Guest Book
icon Information

line

icon To Korean Page




visitors: 83514
 
Contact us
GPT Corporation.
[Korea]
Address:
Room No.703, Youngdong Techno Tower, 300-4, Seongsu-dong 2-ga Seongdong-gu Seoul 133-120 Korea
Phone:
82-2-4612701
Contact name:
John Shin , CEO
Inquire now









GPT Corporation.
 
Electronics

LED
Inquire now
LED
Click to enlarge image


Infrared LED Chip
Stands for IRED(Infrared Emitting Diode) Chip. The manufactured chip is used for IR Emitter, TV remote controller, optical switch, IR LAN, and for a module for wireless digital data communication.

Visible LED Chip
 Stands for VLED (Visible Light Emitting Diode) Chip, whose color covers red, green and orange etc. This chip is assembled into lamp to be used for light source of indication or signal of various electric products .

Semiconductor used for LED

General Level
GaP / GaN / GaAs / GaAIAs
Green, Red/ Blue / Red Infrared / Red Infrared

Super Level
 GaAIAs / GaAsP / GaN / InGaN / GaP
Red / Red, Yellow / Blue / Green / Green

Ultra Level
GaAIAs / InGaAIP / GaN / InGaN
Red / Yellow, Orange, Red / Blue / Green


Color of LED by wavelengths
LED is divided into General level, Super level, Ultra level, depending on the curving angle. 100mcd and under belongs to General level, 500mcd and under belonging to Super level, and 500mcd and over belongs to Ultra level.


LED production process

In-line process
In-line processing consists of die bonding process and wire bonding process. These two processes are made automatically by automatic image recognition system. In die bonding process, it is important to place the chip on silver epoxy already spread on the center of the lead frame cup with proper pressure, on the other hand in wire bonding process, it is important to bond gold wire with electrode of the upper side of semiconductor and lead frame of one side with proper pressure to connect.

Mold process
Mold process is a process where the lead frame with the chip bonded is molded into epoxy. LED lamp is completed when idiomorph is spread automatically and the lead frame is soaked in the mold cup where epoxy is soaked, finally to be hardened in the electric oven.

Test and classification process
 A process where of the electric and optical characteristics of LED are measured to classify depending on the performances.

Tapping process
A process where the LED lamp is formed and attached on the tape so that it can be used for the automatic inserter which allows electric devices to be inserted into the PCB board automatically.


Related Keywords: LED


Inquire now